Dutch semiconductor company NXP has teamed up with TSMC-backed Vanguard International Semiconductor (VIS) to build a $7.8bn (€7.2bn) chipmaking plant in Singapore. The new factory will make 300mm silicon wafers for 130-nanometre to 40-nanometre chips, which power applications in the industrial, automotive, consumer, and mobile markets. These chips are less advanced than those TSMC itself manufactures in Taiwan. But the 300mn wafer capability marks a first for VIS, which currently fabricates 200mm wafers at its existing plant in Singapore. The larger size of the 300mn wafers enables the production of a higher number of chips. Construction of the fab will begin…This story continues at The Next Web

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